Hp DL365 Instrukcja Użytkownika Strona 1

HP ProLiant DL365 Server Maintenance and Service Guide Part Number 418289-005 March 2008 (Fifth Edition)

Customer self repair 10 periode, gewoonlijk vijf (5) werkdagen, retourneren aan HP. Het defecte onderdeel moet met de bijbehorende documentatie word

Customer self repair 11 Para obter mais informações sobre o programa de reparo feito pelo cliente da HP, entre em contato com o fornecedor de serviç

Customer self repair 12

Customer self repair 13

Customer self repair 14

Customer self repair 15

Illustrated parts catalog 16 Illustrated parts catalog Mechanical components Item Description Spare part number Customer self repair (on page 5) 1

Illustrated parts catalog 17 Item Description Spare part number Customer self repair (on page 5) Rack mounting hardware 5 Rack mounting hardware

Illustrated parts catalog 18 sustitución de estos componentes. Dichos componentes se identifican con la palabra “No” en el catálogo ilustrado de com

Illustrated parts catalog 19 System components Item Description Spare part number Customer self repair (on page 5) 7 System fan module 412212-00

© Copyright 2006, 2008 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice. The only warr

Illustrated parts catalog 20 Item Description Spare part number Customer self repair (on page 5) k) 3.0-GHz, 95-W AMD Opteron™* 451810-001 Option

Illustrated parts catalog 21 Item Description Spare part number Customer self repair (on page 5) Miscellaneous 27 SAS cable* 408763-001 Mandator

Illustrated parts catalog 22 3No: No—Algunos componentes no están diseñados para que puedan ser reparados por el usuario. Para que el usuario haga v

Removal and replacement procedures 23 Removal and replacement procedures Required tools You need the following items for some procedures: • T-10 Tor

Removal and replacement procedures 24 This symbol indicates the presence of electric shock hazards. The area contains no user or field serviceabl

Removal and replacement procedures 25 Preparation procedures To access some components and perform certain service procedures, you must perform one

Removal and replacement procedures 26 IMPORTANT: If installing a hot-plug device, it is not necessary to power down the server. 1. Back up the

Removal and replacement procedures 27 Hot-plug SAS or SATA hard drives CAUTION: To prevent improper cooling and thermal damage, do not operate

Removal and replacement procedures 28 6. Remove the T-10 Torx screws located on the sides of the bezel. 7. Gently push on the two tabs located at t

Removal and replacement procedures 29 2. Remove the hard drive bezel blank. To replace the component, reverse the removal procedure. Hot-plug powe

Contents 3 Contents Customer self repair...

Removal and replacement procedures 30 3. Remove the power supply. To replace the component, reverse the removal procedure. Power supply blank Remo

Removal and replacement procedures 31 CAUTION: Do not operate the server for long periods with the access panel open or removed. Operating the ser

Removal and replacement procedures 32 To remove the component: 1. Power down the server (on page 25). 2. Extend or remove the server from the rack (

Removal and replacement procedures 33 o HP Smart Array E200i battery tray o HP Smart Array P400i battery tray To replace the component, reverse th

Removal and replacement procedures 34 3. Remove the access panel ("Access panel" on page 30). 4. Remove the air baffle ("Air baffle&q

Removal and replacement procedures 35 NOTE: Access to the ejector button is intentionally restricted. To eject the optical device, push the ejecto

Removal and replacement procedures 36 9. Remove the multibay backplane assembly. 10. Remove the multibay backplane board from the assembly. To repl

Removal and replacement procedures 37 10. Disconnect the power and data cables from the SAS backplane. 11. Remove the three T-15 Torx screws from t

Removal and replacement procedures 38 4. Remove the front bezel ("Front bezel" on page 27). 5. Remove the air baffle ("Air baffle&quo

Removal and replacement procedures 39 CAUTION: To prevent damage to the server or expansion boards, power down the server and remove all AC power

Contents 4 PCI Smart Array controller cabling...59

Removal and replacement procedures 40 6. Remove any expansion board installed in the assembly. To replace the component, reverse the removal proced

Removal and replacement procedures 41 8. Remove the full-length PCI Express riser board from the riser board assembly. To replace the component, re

Removal and replacement procedures 42 6. Disconnect the backplane power cable from the system board. 7. Turn the quarter-turn fasteners and lift th

Removal and replacement procedures 43 6. Remove the DIMM. To replace the component, reverse the removal procedure. Heatsink To remove the componen

Removal and replacement procedures 44 1. Use the alcohol swab to remove all the existing thermal grease from the processor. Allow the alcohol to eva

Removal and replacement procedures 45 The server uses embedded PPMs as DC-to-DC converters to provide the proper power to each processor. WARNING

Removal and replacement procedures 46 6. Remove the heatsink. 7. Open the processor retaining latch and the processor socket retaining bracket.

Removal and replacement procedures 47 8. Using your fingers, remove the failed processor. IMPORTANT: Be sure the replacement processor remains

Removal and replacement procedures 48 11. Press down firmly until the processor installation tool clicks and separates from the processor, and th

Removal and replacement procedures 49 12. Close the processor retaining latch and the processor socket retaining bracket. 13. Clean the old thermal

Customer self repair 5 Customer self repair HP products are designed with many Customer Self Repair (CSR) parts to minimize repair time and allow fo

Removal and replacement procedures 50 15. Install the heatsink. 16. Install the air baffle ("Air baffle" on page 31). 17. Install the acc

Removal and replacement procedures 51 5. Remove the battery. IMPORTANT: Replacing the system board battery resets the system ROM to its default

Removal and replacement procedures 52 CAUTION: To help avoid damage to the processor and system board, do not install the processor without using

Removal and replacement procedures 53 12. For each installed processor, open the processor retaining latch and the processor socket retaining bracke

Removal and replacement procedures 54 14. Remove the failed system board. To replace the system board: 1. Install the spare system board in the ser

Removal and replacement procedures 55 b. Open the processor retaining latch and the processor socket retaining bracket. 3. Install the processor so

Removal and replacement procedures 56 5. Close the processor retaining latch and the processor socket retaining bracket. 6. Clean the old thermal g

Removal and replacement procedures 57 10. Install all power supplies ("Hot-plug power supply" on page 29). 11. Install the access panel (&

Cabling 58 Cabling Cabling overview This section provides guidelines that help you make informed decisions about cabling the server and hardware opti

Cabling 59 HP Smart Array P400i Controller cabling CAUTION: When routing cables, use the cable trough between fan modules 1 and 2. Be sure th

Customer self repair 6 • Obligatoire - Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à HP de remplacer ces pi

Cabling 60 Battery pack cabling • HP Smart Array E200i Controller battery pack cabling

Cabling 61 • HP Smart Array P400i Controller battery pack cabling

Diagnostic tools 62 Diagnostic tools Troubleshooting resources The HP ProLiant Servers Troubleshooting Guide provides procedures for resolving commo

Diagnostic tools 63 HP Insight Diagnostics survey functionality HP Insight Diagnostics (on page 64) provides survey functionality that gathers criti

Diagnostic tools 64 For more information, refer to the Management CD in the HP ProLiant Essentials Foundation Pack. Automatic Server Recovery ASR i

Diagnostic tools 65 Open Services Event Manager OSEM is a standalone tool that performs real-time reactive and proactive service event filtering, an

Component identification 66 Component identification Front panel components Item Description 1 Hard drive bay 5 (optional)* 2 Hard drive bay 6

Component identification 67 Front panel LEDs and buttons Item Description Status 1 Power On/Standby button and system power LED Green = System

Component identification 68 Item Description Status 6 NIC 2 link/activity LED Green = Network link exists. Flashing green = Network link and acti

Component identification 69 Rear panel LEDs and buttons Item Description Status 1 iLO 2 NIC activity LED Green = Activity exists. Flashing gree

Customer self repair 7 NOTA: alcuni componenti HP non sono progettati per la riparazione da parte del cliente. Per rispettare la garanzia, HP richi

Component identification 70 System board components Item Description 1 System battery 2 NMI jumper 3 System maintenance switch (SW1) 4 Internal

Component identification 71 System maintenance switch Position Default Function S1 Off Off = iLO 2 security is enabled. On = iLO 2 security is d

Component identification 72 To view the LEDs, access the HP Systems Insight Display. LED Status Off Normal Amber Failure For additional inform

Component identification 73 HP Systems Insight Display LED and color Internal health LED color Status PPM failure (amber) Red Integrated PPM has f

Component identification 74 • Six hard drive configuration SAS and SATA hard drive LEDs Item Description 1 Fault/UID LED (amber/blue) 2 Onl

Component identification 75 SAS and SATA hard drive LED combinations Online/activity LED (green) Fault/UID LED (amber/blue) Interpretation On,

Component identification 76 Fan locations Item Description 1 Fan module 1 2 Fan module 2 3 Fan module 3

Specifications 77 Specifications Environmental specifications Specification Value Temperature range* Operating 10°C to 35°C (50°F to 95°F) Ship

Specifications 78 Specification Value Rated steady-state power 700 W Hot-plug power supply calculations For hot-plug power supply specifications a

Specifications 79 Specification Value Track-to-track (high/low) 3 ms/6 ms Average (high/low) 169 ms/94 ms Setting time 15 ms Latency average 100

Customer self repair 8 anrufen und sich von einem Mitarbeiter per Telefon helfen lassen. Den Materialien, die mit einem CSR-Ersatzteil geliefert wer

Specifications 80 Specification Value Operating conditions Temperature 5°C to 45°C (41°F to 118°F) Humidity 5% to 90% DVD-ROM drive specificati

Specifications 81 Specification Value Operating conditions Temperature 5°C to 45°C (41°F to 118°F) Humidity 5% to 90% SAS hard drive specificat

Acronyms and abbreviations 82 Acronyms and abbreviations ABEND abnormal end ASR Automatic Server Recovery BBWC battery-backed write cache DDR dou

Acronyms and abbreviations 83 RBSU ROM-Based Setup Utility SAS serial attached SCSI SATA serial ATA SFF small form-factor SIM Systems Insight Ma

Index 84 A access panel 30 additional information 62 ADU (Array Diagnostic Utility) 62 air baffle 25, 31 array controller, cabling 58, 59 a

Index 85 LEDs 66, 75 LEDs, hard drive 74, 75 LEDs, NIC 67, 69 LEDs, power button/LED board 67 LEDs, unit identification (UID) 67 M manageme

Customer self repair 9 Centro de asistencia técnica de HP y recibirá ayuda telefónica por parte de un técnico. Con el envío de materiales para la su