Hp DM4 Instrukcja Użytkownika Pobierz pdf (Strona 82)

4. Remove the fan/heat sink assembly (2).

The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink

assembly (1), the processor (2) and the graphics processor (3) on the system board each time

the fan/heat sink assembly is removed. Thermal pads and thermal paste must be installed on all

surfaces before the fan/heat sink assembly is reinstalled.

The following illustration shows the locations for thermal material on systems with discrete

graphics subsystems.

NOTE: Steps 5 through 7 apply to computers with UMA subsystem memory on the system

board. Steps 1 through 4 apply to computers with discrete subsystem memory.

74 Chapter 4 Removal and replacement procedures

1 2 ... 77 78 79 80 81 82 83 84 85 86 87 ... 112 113

Brak uwag

Hp DM4 Instrukcja Użytkownika Strona 82