HP DV3 Informacje Techniczne Strona 77

  • Pobierz
  • Dodaj do moich podręczników
  • Drukuj
  • Strona
    / 116
  • Spis treści
  • BOOKMARKI
  • Oceniono. / 5. Na podstawie oceny klientów
Przeglądanie stron 76
NOTE: The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink
assembly and the system board each time the fan/heat sink assembly is removed:
●
Thermal paste is used on the processor (1) and the heat sink section (2) that services it
●
Thermal pads are used on the graphics subsystem chip (3) and the heat sink section (4) that
services it
Replacement thermal material is included with all fan/heat sink assembly, system board, and
processor spare part kits.
Reverse this procedure to install the fan/heat sink assembly.
Component replacement procedures 67
Przeglądanie stron 76
1 2 ... 72 73 74 75 76 77 78 79 80 81 82 ... 115 116

Komentarze do niniejszej Instrukcji

Brak uwag