HP DV3 Informacje Techniczne Strona 77

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NOTE: The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink
assembly and the system board each time the fan/heat sink assembly is removed:
Thermal paste is used on the processor (1) and the heat sink section (2) that services it
Thermal pads are used on the graphics subsystem chip (3) and the heat sink section (4) that
services it
Replacement thermal material is included with all fan/heat sink assembly, system board, and
processor spare part kits.
Reverse this procedure to install the fan/heat sink assembly.
Component replacement procedures 67
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