Heat Dissipation**
Heat Dissipation**Heat Dissipation**
Heat Dissipation**
115 VAC
115 VAC115 VAC
115 VAC 230 VAC
230 VAC230 VAC
230 VAC 100 VAC
100 VAC100 VAC
100 VAC
LAN Enabled
LAN Disabled
LAN Enabled
LAN Disabled
LAN Enabled
LAN Disabled
On-Idle (ENERGY STAR®
Idle (S0))
212.92 btu/hr 211.72 btu/hr 212.98 btu/hr
ENERGY STAR® "Sleep"
(S3)
13.1 btu/hr
-
13.8 btu/hr
-
13.1 btu/hr
-
ENERGY STAR® "Standby"
(Off) (S5)
2.97 btu/hr
-
3.51 btu/hr
-
2.93 btu/hr
-
NOTES
NOTESNOTES
NOTES
:
* Energy Star low energy mode
** Heat dissipation is calculated based on the measured watts, assuming the service level is attained for one hour.
This product is in compliance with US executive order 13221.
Environmental
EnvironmentalEnvironmental
Environmental
Requirements
RequirementsRequirements
Requirements
Temperature
TemperatureTemperature
Temperature
Operating: 40° to 95° F (5° to 35° C)
Non-operating: -40° to 140° F (-40° to 60° C)
Humidity
HumidityHumidity
Humidity
Operating: 8% to 85% RH, non-condensing
Non-operating: 8% to 90% RH, non-condensing
Maximum Altitude
Maximum AltitudeMaximum Altitude
Maximum Altitude
Operating: 10,000 feet (3,000 m)
Non-operating: 30,000 feet (9,100 m)
Dynamic
DynamicDynamic
Dynamic
(new)
Shock
Operating: ½-sine: 40g, 2-3ms
Non-operating:
½-sine: 160 cm/s, 2-3ms (~100g)
square: 422 cm/s, 20g
Vibration
Operating random: 0.5g (rms), 5-300 Hz
Non-operating random: 2.0g (rms), 10-500 Hz
NOTES:
NOTES:NOTES:
NOTES:
Values represent individual shock events and do not indicate
repetitive shock events.Values do not indicate continuous vibration.
Cooling
CoolingCooling
Cooling
Above 5,000 ft (1524 m) altitude, maximum operating temperature is de-
rated by 1.8° F (1° C) per 1,000 ft (305 m) elevation increase
Physical Security and Serviceability
Physical Security and ServiceabilityPhysical Security and Serviceability
Physical Security and Serviceability
Access Panel
Access PanelAccess Panel
Access Panel
Tool-less
Includes system board and memory information
Expansion Cards
Expansion CardsExpansion Cards
Expansion Cards
Tool-less
Processor Socket
Processor SocketProcessor Socket
Processor Socket
Tool-less, except for the processor heatsink.
Green User Touch Points
Green User Touch PointsGreen User Touch Points
Green User Touch Points
Yes, on tool-free internal chassis mechanisms
Color-coordinated Cables
Color-coordinated CablesColor-coordinated Cables
Color-coordinated Cables
and Connectors
and Connectorsand Connectors
and Connectors
Yes
Memory
MemoryMemory
Memory
Tool-less
System Board
System BoardSystem Board
System Board
Screw-In
QuickSpecs
HP Z200 Small Form Factor Workstation
HP Z200 Small Form Factor WorkstationHP Z200 Small Form Factor Workstation
HP Z200 Small Form Factor Workstation
System Technical Specifications
DA - 13593 Worldwide — Version 4 — July 1, 2010
Page 16
(70 strony)
(88 strony)
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