HP E5440 Dokumentacja Pobierz pdf (Strona 54)

1U Alternative Heatsink Thermal/Mechanical Design

54 Quad-Core Intel® Xeon® Processor 5400 Series TMDG

A.2 Thermal Solution Performance Characterics

Figure A-2 shows the performance of the 1U alternative heatsink. This figure shows the

thermal performance and the pressure drop through fins of the heatsink versus the

airflow provided. The best-fit equations for these curves are also provided to make it

easier for users to determine the desired value without any error associated with

reading the graph.

A.3 Thermal Profile Adherence

The 1U alternative thermal solution is designed to meet the Thermal Profile for the

Quad-Core Intel® Xeon® Processor E5400 Series in volumetrically constrained form

factors. From Tabl e A- 1 the three-sigma (mean+3sigma) performance of the thermal

solution is computed to be 0.331 °C/W and the processor local ambient temperature

) for this thermal solution is 40 °C. Hence, the Thermal Profile equation for this

thermal solution is calculated as:

Equation A-1. y = 0.331*x + 40

where,

y = Processor T

CASE

value (°C)

Figure A-2. 1U Alternative Heatsink Thermal Performance

Table A-1. 1U Alternative Heatsink Thermal Mechanical Characteristics

Size

Height Weight Target Airflow

Through Fins

Mean Ψ

Standard

Deviation Ψ

Pressure

Drop

(mm) [in.] (kg) [lbs] (m

/hr) [CFM] (°C/W) (°C/W)

(Pa) [in

1U 27.00

[1.06]

0.24 [0.53] 25.5 [15] 0.305 0.0087 85 [0.34]

1 2 ... 49 50 51 52 53 54 55 56 57 58 59 ... 99 100

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HP E5440 Dokumentacja Strona 54