HP KC.32101.DMP podręczniki

Hp KC.32101.DMP Arkusz Danych (168 strony)

Marka: Hp | Kategoria: Procesory | Rozmiar: 4.12 MB |

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Spis treści

Mobile 3rd Generation Intel

1

Processor Family

1

2 Datasheet, Volume 1

2

Contents

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4 Datasheet, Volume 1

4

Datasheet, Volume 1 5

5

6 Datasheet, Volume 1

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Datasheet, Volume 1 7

7

8 Datasheet, Volume 1

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Revision History

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10 Datasheet, Volume 1

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1 Introduction

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Processor

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1.1 Processor Feature Details

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1.2 Interfaces

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1.2.2 PCI Express*

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Datasheet, Volume 1 15

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Introduction

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1.2.5 Processor Graphics

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1.3 Power Management Support

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Core™ Processor

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Family SKU Definition

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1.5 Package

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1.6 Processor Compatibility

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1.7 Terminology

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1.8 Related Documents

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2 Interfaces

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2.1.3.1 Single-Channel Mode

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Flex Memory Technology Mode

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Interfaces

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26 Datasheet, Volume 1

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2.1.5.2 Command Overlap

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2.2 PCI Express* Interface

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2.2.1.1 Transaction Layer

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2.2.1.2 Data Link Layer

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2.2.1.3 Physical Layer

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30 Datasheet, Volume 1

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2.2.3 PCI Express* Graphics

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2.3.1 DMI Error Flow

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2.3.3 DMI Link Down

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Datasheet, Volume 1 33

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2.4.1.2 3D Pipeline

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2.4.1.3 Video Engine

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2.4.1.4 2D Engine

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2.4.2.1 Display Planes

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2.4.2.2 Display Pipes

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2.4.2.3 Display Ports

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2.6 Interface Clocking

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3 Technologies

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Technologies

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40 Datasheet, Volume 1

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3.2 Intel

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3.3 Intel

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Hyper-Threading Technology

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3.4 Intel

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Turbo Boost Technology

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3.4.1 Intel

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3.4.2 Intel

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3.5 Intel

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3.7 Intel

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64 Architecture x2APIC

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46 Datasheet, Volume 1

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4 Power Management

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4.1 ACPI States Supported

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4.1.5 DMI States

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4.2.1 Enhanced Intel

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SpeedStep

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Technology

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4.2.2 Low-Power Idle States

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4.2.4.1 Core C0 State

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4.2.4.2 Core C1/C1E State

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4.2.4.3 Core C3 State

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4.2.4.4 Core C6 State

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4.2.4.5 Core C7 State

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4.2.4.6 C-State Auto-Demotion

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4.2.5.1 Package C0

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4.2.5.2 Package C1/C1E

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4.2.5.3 Package C3 State

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4.2.5.4 Package C6 State

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4.2.5.5 Package C7 State

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4.3 IMC Power Management

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Power Management

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58 Datasheet, Volume 1

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Datasheet, Volume 1 59

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4.5 DMI Power Management

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4.6 Graphics Power Management

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62 Datasheet, Volume 1

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(SDRRST)

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64 Datasheet, Volume 1

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5 Thermal Management

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5.3 Intel

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System Thermal Response Time

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5.3.2 Power Plane Control

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5.3.3 Turbo Time Parameter

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5.4.1 Configurable TDP

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Thermal Management

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Mode Description

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Note Definition

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Table 5-3. TDP Specifications

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Max Units Notes

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Segment Symbol

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Idle Parameter Min Typ Max

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Units Notes

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5.6.1.1 TCC Activation Offset

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5.6.1.3 Clock Modulation

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78 Datasheet, Volume 1

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5.6.3.5 THERMTRIP# Signal

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80 Datasheet, Volume 1

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6 Signal Description

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6.1 System Memory Interface

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Table 6-3. Memory Channel B

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6.6 Intel

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Table 6-10. PLL Signals

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Table 6-8. Intel

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6.11 Power Sequencing

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6.12 Processor Power Signals

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6.13 Sense Signals

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6.14 Ground and NCTF

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7 Electrical Specifications

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7.4 System Agent (SA) Vcc VID

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7.6 Signal Groups

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(Prior to Board Attach)

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7.9 DC Specifications

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Table 7-5. Processor Core (V

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Electrical Specifications

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Table 7-9. Processor PLL (V

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± 200 mV and the

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DC Specifications

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108 Datasheet, Volume 1

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8 Processor Pin, Signal, and

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Datasheet, Volume 1 121

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122 Datasheet, Volume 1

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140 Datasheet, Volume 1

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Datasheet, Volume 1 141

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156 Datasheet, Volume 1

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Datasheet, Volume 1 157

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158 Datasheet, Volume 1

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Datasheet, Volume 1 159

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160 Datasheet, Volume 1

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Datasheet, Volume 1 161

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162 Datasheet, Volume 1

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Datasheet, Volume 1 163

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164 Datasheet, Volume 1

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9 DDR Data Swizzling

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Table – Channel A

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DDR Data Swizzling

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168 Datasheet, Volume 1

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