Hp ProLiant DL580 G3 Server Instrukcja Użytkownika Strona 179
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Server specifications
In this section
Environmental specifications .....................................................................................................179
Server specifications...................................................................................................................179
Environmental specifications
Specification Value
Temperature range*
Operating
10°C to 35°C (50°F to 95°F)
Shipping
-40°C to 70°C (-40°F to 158°F)
Maximum wet bulb temperature
28°C (82.4°F)
Relative humidity
(noncondensing)**
Operating 10% to 90%
Non-operating 5% to 95%
* All temperature ratings shown are for sea level. An altitude derating of 1°C per 300 m
(1.8°F per 1,000 ft) to 3048 m (10,000 ft) is applicable. No direct sunlight allowed.
** Storage maximum humidity of 95% is based on a maximum temperature of 45°C
(113°F). Altitude maximum for storage corresponds to a pressure minimum of 70 KPa.
Server specifications
Specification Value
Dimension
Height 17.6 cm (6.94 in)
Depth 67.3 cm (26.5 in)
- User Guide 1
- Audience assumptions 2
- Contents 3
- Front panel components 10
- Front panel LEDs and buttons 11
- Processor module LEDs 15
- Rear panel components 16
- Rear panel LEDs and buttons 17
- Power supply LEDs 18
- System board components 20
- System maintenance switch 21
- Boot device selector switch 22
- DIMM slot locations 25
- SCSI IDs 26
- Duplex mode 27
- SATA or SAS IDs 29
- SATA or SAS hard drive LEDs 30
- Fan locations 32
- 33
- Hot-plug fan LEDs 34
- BBWC LEDs 35
- Server operations 37
- Server operations 39 39
- Removing the access panel 40
- Replacing hot-plug fans 41
- Removing the system cage 42
- Server operations 43 43
- Battery 44
- Server operations 45 45
- Server setup 47
- Rack planning resources 48
- Optimum environment 49
- Temperature requirements 50
- Power requirements 51
- Rack warnings and cautions 52
- Server setup 53 53
- Installing hardware options 54
- Server setup 55 55
- Registering the server 56
- Introduction 57
- Processor options 57
- Installing a processor 59
- 9. Install the PPM 62
- Removing a hard drive blank 63
- Battery-Backed Write Cache 73
- Expansion board options 77
- Plug expansion slots 79
- RILOE II Board 93
- Memory options 95
- Advanced ECC memory 97
- Online spare memory 99
- Hot-plug mirrored memory 100
- Memory options 101 101
- Hot-plug RAID memory 102
- Memory Boards and DIMMs 103
- Memory options 105 105
- 3. Open the memory board 106
- 5. Close the memory board 107
- 4. Open the memory board 109
- 6. Close the memory board 110
- Configuring the memory 111
- POST memory test 112
- ROM-based diagnostics 112
- Selecting the AMP mode 112
- Memory options 113 113
- Server cabling 115
- BBWC cabling 116
- RILOE II cabling 117
- Hot-plug SCSI drive cabling 117
- SCSI simplex mode 118
- SCSI duplex mode 118
- Server cabling 119 119
- USB cable assembly 120
- Power switch cable assembly 121
- Configuration tools 123
- SmartStart Scripting Toolkit 124
- HP ROM-Based Setup Utility 125
- Array Configuration Utility 128
- Management tools 130
- Erase Utility 133
- HP Systems Insight Manager 133
- Management Agents 134
- Redundant ROM support 134
- Diagnostic tools 135
- HP Insight Diagnostics 136
- Survey Utility 136
- Integrated Management Log 137
- Array Diagnostic Utility 137
- Keeping the system current 138
- Resource Paqs 139
- ProLiant Support Packs 139
- Care Pack 140
- Electrostatic discharge 141
- Troubleshooting 143
- Server diagnostic steps 144
- Important safety information 144
- Troubleshooting 145 145
- Warnings and cautions 146
- Troubleshooting 147 147
- Symptom information 148
- Service notifications 149
- Loose connections 149
- Diagnostic steps 150
- Troubleshooting 151 151
- General diagnosis flowchart 152
- Troubleshooting 153 153
- Power-on problems flowchart 154
- Troubleshooting 155 155
- POST problems flowchart 157
- OS boot problems flowchart 159
- Troubleshooting 161 161
- Troubleshooting 163 163
- Troubleshooting 165 165
- Other information resources 167
- FCC rating label 170
- Class A equipment 170
- Class B equipment 171
- Modifications 172
- Mouse compliance statement 172
- Japanese notice 174
- BSMI notice 174
- Korean notice A&B 175
- Laser compliance 175
- Battery replacement notice 176
- Server specifications 179
- Technical support 181
- Customer self repair 182
- Acronyms and abbreviations 183
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