Hp DV3 Instrukcja Użytkownika Pobierz pdf (Strona 120)

4–58 Maintenance and Service Guide

Removal and replacement procedures

✎

The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink assembly and the system

board each time the fan/heat sink assembly is removed:

■ Thermal paste is used on the processor 1 and the heat sink section 2 that services it.

■ Thermal pads are used on the Northbridge chip 3 and the heat sink section 4 that services it.

■ Thermal pads are used on the graphics subsystem memory module 5 and the heat sink section 6 that

services it.

■ Thermal pads are used on the other system board components 7 and heat sink sections 8 that service them.

Replacement thermal material is included with all system board, fan/heat sink assembly, and processor spare

part kits.

✎

Steps 4 and 5 apply to computer models equipped with graphics subsystems with UMA memory. See steps 2

and 3 for instructions on removing the fan/heat sink assembly on computer models equipped with graphics

subsystems with discrete memory.

4. Loosen the four captive Phillips PM2.0×7.0 screws 1 that secure the fan/heat sink assembly to the

system board.

5. Remove the fan/heat sink assembly 2.

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Hp DV3 Instrukcja Użytkownika Strona 120