HP AT80613003543AF Arkusz Danych Pobierz pdf (Strona 34)

Package Mechanical Specifications

36 Dual-Core Intel® Xeon® Processor 3000 Series Datasheet

3.1 Package Mechanical Drawing

The package mechanical drawings are shown in Figure 3-2 and Figure 3-3. The

drawings include dimensions necessary to design a thermal solution for the processor.

These dimensions include:

• Package reference with tolerances (total height, length, width, etc.)

• IHS parallelism and tilt

• Land dimensions

• Top-side and back-side component keep-out dimensions

• Reference datums

• All drawing dimensions are in mm [in].

• Guidelines on potential IHS flatness variation with socket load plate actuation and

installation of the cooling solution is available in the processor Thermal/Mechanical

Design Guidelines.

1 2 ... 29 30 31 32 33 34 35 36 37 38 39 ... 101 102

Brak uwag

HP AT80613003543AF Arkusz Danych Strona 34