HP AT80613003543AF Arkusz Danych Pobierz pdf (Strona 76)

Strona główna
HP
Procesory
AT80613003543AF
Arkusz Danych

Pobierz
Podziel się

Dzielenie się
Dodaj do moich podręczników
Drukuj

100

101

102

Thermal Specifications and Design Considerations

78 Dual-Core Intel® Xeon® Processor 3000 Series Datasheet

Table 5-3. Thermal Profile (Dual-Core Intel® Xeon® 3070/3060 Processor

with 4 MB L2 Cache)

Power (W)

Maximum

Tc (°C)

Power

Maximum

Tc (°C)

Power

Maximum

Tc (°C)

0 43.2 24 49.4 48 55.7

2 43.7 26 50.0 50 56.2

4 44.2 28 50.5 52 56.7

6 44.8 30 51.0 54 57.2

8 45.3 32 51.5 56 57.8

10 45.8 34 52.0 58 58.3

12 46.3 36 52.6 60 58.8

14 46.8 38 53.1 62 59.3

16 47.4 40 53.6 64 59.8

18 47.9 42 54.1 65 60.1

20 48.4 44 54.6

Figure 5-2. Thermal Profile (Dual-Core Intel® Xeon® 3070/3060 Processor

with 4 MB L2 Cache)

y = 0.26x + 43.2

40.0

45.0

50.0

55.0

60.0

65.0

0 102030405060

Power (W)

Tcase (C)

1 2 ... 71 72 73 74 75 76 77 78 79 80 81 ... 101 102

Dual-Core Intel 1
Processor 1
Contents 3
1, 2, 3, 4 6
Revision History 7
3000 Series Features 8
1 Introduction 9
1.1.1 Processor Terminology 10
1.2 References 11
1, 2, 5 12
2 Electrical Specifications 13
2.3 Voltage Identification 14
Electrical Specifications 17
Table 2-5. V 19
Figure 2-1. V 20
Table 2-6. V 20
(Sheet 1 of 2) 20
(Sheet 2 of 2) 21
Figure 2-2. V 21
Overshoot 22
2.6.4 Die Voltage Validation 22
2.7 Signaling Specifications 23
2.7.4 Clock Specifications 27
2.8 PECI DC Specifications 31
Table 2-3 for V 32
3 Package Mechanical 33
3.2 Processor Markings 39
INTEL® XEON® 40
SLxxx [COO] 40
2.33GHZ/4M/1333/06 40
Preliminary 41
Socket 775 41
Quadrants 41
Top View 41
4 Land Listing and Signal 43
Descriptions 43
Table 4-1. Alphabetical Land 46
Assignments (Sheet 1 of 20) 46
Assignments (Sheet 2 of 20) 46
Assignments (Sheet 3 of 20) 47
Assignments (Sheet 4 of 20) 47
Assignments (Sheet 5 of 20) 48
Assignments (Sheet 6 of 20) 48
Assignments (Sheet 7 of 20) 49
Assignments (Sheet 8 of 20) 49
Assignments (Sheet 9 of 20) 50
Assignments (Sheet 10 of 20) 50
Assignments (Sheet 11 of 20) 51
Assignments (Sheet 12 of 20) 51
Assignments (Sheet 13 of 20) 52
Assignments (Sheet 14 of 20) 52
Assignments (Sheet 15 of 20) 53
Assignments (Sheet 16 of 20) 53
Assignments (Sheet 17 of 20) 54
Assignments (Sheet 18 of 20) 54
Assignments (Sheet 19 of 20) 55
Assignments (Sheet 20 of 20) 55
(Sheet 1 of 20) 56
(Sheet 2 of 20) 56
(Sheet 3 of 20) 57
(Sheet 4 of 20) 57
(Sheet 5 of 20) 58
(Sheet 6 of 20) 58
(Sheet 7 of 20) 59
(Sheet 8 of 20) 59
(Sheet 9 of 20) 60
(Sheet 10 of 20) 60
(Sheet 11 of 20) 61
(Sheet 12 of 20) 61
(Sheet 13 of 20) 62
(Sheet 14 of 20) 62
(Sheet 15 of 20) 63
(Sheet 16 of 20) 63
(Sheet 17 of 20) 64
(Sheet 18 of 20) 64
(Sheet 19 of 20) 65
(Sheet 20 of 20) 65
5 Thermal Specifications and 73
Design Considerations 73
5.1.2 Thermal Metrology 78
5.2.1 Thermal Monitor 78
5.2.2 Thermal Monitor 2 79
5.3 Thermal Diode 81
PECI Host 84
Controller 84
Domain 0 84
5.4.2.1 PECI Device Address 86
5.4.2.2 PECI Command Support 86
6 Features 87
6.2.2.1 HALT Powerdown State 88
6.2.3.1 Stop Grant State 89
Features 90
6.3 Enhanced Intel 91
SpeedStep 91
Technology 91
7.1 Mechanical Specifications 94
7.2 Electrical Requirements 95
7.3 Thermal Specifications 97
7.3.2 Variable Speed Fan 99
8 Debug Tools Specifications 101
Debug Tools Specifications 102

Komentarze do niniejszej Instrukcji

Brak uwag

HP AT80613003543AF Arkusz Danych Strona 76

Komentarze do niniejszej Instrukcji

Powiązane produkty i podręczniki dla Procesory HP AT80613003543AF