Hp ProLiant BL680c G7 Server-Blade Instrukcja Użytkownika Pobierz pdf (Strona 21)

Operations 21

Remove the right DIMM baffle.

Remove the front panel/hard drive cage assembly

(A-side)

To remove the component:

1. Power down the server blade (on page 16).

2. Remove the server blade (on page 17).

3. Place the server blade on a flat, level surface with the correct side of the server blade facing up. To

determine the correct side, see the label attached to the access panel.

4. Remove the access panel (A-side) (on page 18).

5. Disconnect the signal cable and the power cable from the SAS backplane.

6. Loosen the thumbscrews.

1 2 ... 16 17 18 19 20 21 22 23 24 25 26 ... 133 134

User Guide 1
Contents 3
Contents 4 4
Contents 5 5
Contents 6 6
Component identification 7
SAS and SATA hard drive LEDs 8
Item Description 10
System maintenance switch 11
Interposer board components 12
DIMM slot locations (A-side) 13
DIMM slot locations (B-side) 14
HP c-Class Blade SUV Cable 14
Item Connector Description 15
Operations 16
Remove the server blade 17
Remove the left DIMM baffle 19
Remove the right DIMM baffle 20
(A-side) 21
(B-side) 22
Remove the interposer board 23
Remove the battery pack 24
Overview 26
Remove the device bay blank 27
Setup 28 28
Setup 30 30
Installing a server blade 32
Completing the configuration 33
Introduction 34
Processor option 34
Memory option 47
Dual- and quad-rank DIMMs 48
DIMM identification 48
DIMM installation guidelines 49
Channel Slot Slot number 51
Hemisphere mode 52
Memory RAS 54
HP Memory Quarantine 56
Installing DIMMs (A-side) 57
Installing DIMMs (B-side) 58
Remove the hard drive blank 60
Prepare the hard drive 60
Mezzanine card option 61
Controller options 65
Installing a cache module 66
Installing a capacitor pack 67
BitLocker™ enabled 70
Additional TPM features 71
Cabling 72
Network-based PXE deployment 75
Deployment overview 76
Deployment infrastructure 76
Deployment methods 77
PXE deployment 78
CD-ROM deployment 78
Diskette image deployment 79
SAN configuration 80
Configuration tools 81
HP ROM-Based Setup Utility 82
Boot options 83
BIOS Serial Console 83
Configuring AMP modes 83
Array Configuration Utility 84
Management tools 85
Erase Utility 86
Redundant ROM support 86
Internal SD support 87
Diagnostic tools 88
Keeping the system current 89
Version control 90
ProLiant Support Packs 90
Firmware 90
HP Smart Update Manager 90
Care Pack 91
Troubleshooting 92
Symbols on equipment 93
Warnings 93
Symptom information 94
Troubleshooting 95 95
Loose connections 96
Service notifications 96
Server health LEDs 96
Troubleshooting flowcharts 96
Start diagnosis flowchart 97
General diagnosis flowchart 98
Symptoms: 100
POST problems flowchart 102
OS boot problems flowchart 104
• Corrupted OS 105
• Redundancy failure 107
(http://www.hp.com/support) 108
Troubleshooting 109 109
System battery 110
FCC rating label 111
Class A equipment 111
Class B equipment 111
Modifications 112
• EMC Directive 2004/108/EC 113
Japanese notice 114
BSMI notice 114
Korean notice 114
Chinese notice 115
Laser compliance 115
Battery replacement notice 115
Wireless devices 116
Japanese notices 117
Taiwan notices 117
Electrostatic discharge 118
Specifications 119
Technical support 120
Technical support 121 121
Customer Self Repair 122
Technical support 123 123
Reparo feito pelo cliente 124
Technical support 125 125
Technical support 126 126
Technical support 127 127
Acronyms and abbreviations 128
Index 131 131
Index 132 132
Index 133 133
Index 134 134

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