Hp ProLiant BL680c G7 Server-Blade Instrukcja Użytkownika Strona 31
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Setup 31
• HP BladeSystem c3000 Enclosure
To support network connections for specific signals, install an interconnect module in the bay corresponding
to the embedded adapter or mezzanine signals.
Server blade signal c7000 interconnect bay c3000 interconnect bay Interconnect bay labels
FlexFabric adapter 1
(Embedded)
1 1
FlexFabric adapter 2
(Embedded)
2 1
FlexFabric adapter 3
(Embedded)
1 1
FlexFabric adapter 4
(Embedded)
2 1
FlexFabric adapter 5
(Embedded)
1 1
FlexFabric adapter 6
(Embedded)
2 1
Mezzanine 1
3 and 4 2
Mezzanine 2
5 and 6* 3 and 4
7 and 8** 3 and 4
Mezzanine 3
5 and 6** 3 and 4
7 and 8* 3 and 4
Mezzanine 4
5 and 6** 3 and 4
7 and 8* 3 and 4
Mezzanine 5
3 and 4 2
Mezzanine 6
1 and 2
†
1
Mezzanine 7
5 and 6* 3 and 4
7 and 8** 3 and 4
* Dual port mezzanine card ports and four-port mezzanine card ports 1 and 2
** Four-port mezzanine card ports 3 and 4
- User Guide 1
- Contents 3
- Contents 4 4
- Contents 5 5
- Contents 6 6
- Component identification 7
- SAS and SATA hard drive LEDs 8
- Item Description 10
- System maintenance switch 11
- Interposer board components 12
- DIMM slot locations (A-side) 13
- DIMM slot locations (B-side) 14
- HP c-Class Blade SUV Cable 14
- Item Connector Description 15
- Operations 16
- Remove the server blade 17
- Remove the left DIMM baffle 19
- Remove the right DIMM baffle 20
- (A-side) 21
- (B-side) 22
- Remove the interposer board 23
- Remove the battery pack 24
- Overview 26
- Remove the device bay blank 27
- Setup 28 28
- Setup 30 30
- Installing a server blade 32
- Completing the configuration 33
- Introduction 34
- Processor option 34
- Memory option 47
- Dual- and quad-rank DIMMs 48
- DIMM identification 48
- DIMM installation guidelines 49
- Channel Slot Slot number 51
- Hemisphere mode 52
- Memory RAS 54
- HP Memory Quarantine 56
- Installing DIMMs (A-side) 57
- Installing DIMMs (B-side) 58
- Remove the hard drive blank 60
- Prepare the hard drive 60
- Mezzanine card option 61
- Controller options 65
- Installing a cache module 66
- Installing a capacitor pack 67
- BitLocker™ enabled 70
- Additional TPM features 71
- Cabling 72
- Network-based PXE deployment 75
- Deployment overview 76
- Deployment infrastructure 76
- Deployment methods 77
- PXE deployment 78
- CD-ROM deployment 78
- Diskette image deployment 79
- SAN configuration 80
- Configuration tools 81
- HP ROM-Based Setup Utility 82
- Boot options 83
- BIOS Serial Console 83
- Configuring AMP modes 83
- Array Configuration Utility 84
- Management tools 85
- Erase Utility 86
- Redundant ROM support 86
- Internal SD support 87
- Diagnostic tools 88
- Keeping the system current 89
- Version control 90
- ProLiant Support Packs 90
- Firmware 90
- HP Smart Update Manager 90
- Care Pack 91
- Troubleshooting 92
- Symbols on equipment 93
- Warnings 93
- Symptom information 94
- Troubleshooting 95 95
- Loose connections 96
- Service notifications 96
- Server health LEDs 96
- Troubleshooting flowcharts 96
- Start diagnosis flowchart 97
- General diagnosis flowchart 98
- Symptoms: 100
- POST problems flowchart 102
- OS boot problems flowchart 104
- • Corrupted OS 105
- • Redundancy failure 107
- (http://www.hp.com/support) 108
- Troubleshooting 109 109
- System battery 110
- FCC rating label 111
- Class A equipment 111
- Class B equipment 111
- Modifications 112
- • EMC Directive 2004/108/EC 113
- Japanese notice 114
- BSMI notice 114
- Korean notice 114
- Chinese notice 115
- Laser compliance 115
- Battery replacement notice 115
- Wireless devices 116
- Japanese notices 117
- Taiwan notices 117
- Electrostatic discharge 118
- Specifications 119
- Technical support 120
- Technical support 121 121
- Customer Self Repair 122
- Technical support 123 123
- Reparo feito pelo cliente 124
- Technical support 125 125
- Technical support 126 126
- Technical support 127 127
- Acronyms and abbreviations 128
- Index 131 131
- Index 132 132
- Index 133 133
- Index 134 134
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