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Environmental s
pecifications
To ensure optimum product operation, you must m aintain the operational environmental specifications
listed in Table
31. The ambient temperature (the enclosure air intake or room temperature) is especially
critical.
Table 31 Environmental operating specifications
Ambient temper
ature:+10°Cto+35°C(+50°Fto+95°F)withanaveragerateofchangeof1°C/hour
maximum and a step change of 3 °C or less. Maintaining the optimum ambient temperature within the
specified rang
e ensures that the internal operating temperatures support the drive manufacturer’s MT B F
specifications.
Relative humidity: 40% to 60% (noncondensing) with a step change of 10% or less (noncondensing)
Air qualit y: Not to exceed a maximum of 500,000 particles, 0.5 micron or larger, per cubic foot of air.
Heat dissipa
tion:1600BTUsperhour
When shippin
g, or placing this product in short term storage, HP recommends maintaining the
environmental c onditions listed in Table 32.
Table 32 Environmental shipping or sh ort-term s torage specifications
Ambient temperature:–40°Cto+66°C(–40°Fto+151°F)
Relative humidity: 10% to 80% (noncondensing)
Altitude: 15,240 m (50,000 ft)
Power specifications
The input voltage to the drive enclosure power supplies is a function of the country -specificinputvoltage
to Enterprise storage system rack power distribution u nits (PDUs). Enterprise storage sy stem AC input line
voltages defines the AC input power available to the drive enclosure p ower supplies.
CAUTION:
The AC power distribution within a rack ensures a balanced to each PDA and reduces the possibility of
an overload c ondition. Changing the cabling to or from a PDM could cause an overload condition.
4000/6000/8000 Enterprise Virtual Array user guide
117
- HP StorageWorks 1
- Contents 3
- About this guide 13
- Document conven 14
- Rack stability 15
- HP technical support 15
- 1 Enterpr ise Virtu al Array 17
- Ease of management 18
- Data availability 18
- Performance 18
- Scalability 18
- Storage system components 19
- HP Command View 20
- Controller software 20
- Hardware 21
- Fibre Channel loop switches 22
- HSV210 and HSV200 controllers 22
- P = Fibre (Host) Port 26
- CA = Fibre Channel Adapter 26
- Dir ect connect 28
- Procedures for g 29
- Entering the WWN 30
- Entering the WWN checksum 31
- 3 Enterpr ise Virtu al Array 33
- Setting Point in time 34
- Behavior 34
- Powering up the s 37
- Creating disk groups 40
- Adding a disk dri v e 41
- Checking status indicators 42
- Handling fiber optic cables 43
- 4 Enterpr ise Virtu al Array 45
- I/O modules 46
- I/O module status indicators 47
- Fibre Optic Fibr 49
- Copper Fibre Channel cables 49
- Fibre Channel disk drives 49
- Disk drive status indicators 50
- Disk drive status displays 50
- Power supplies and blowers 51
- Power supplies 52
- Drive enclosure EMU 53
- EMU functions 54
- EMU monitoring functions 55
- EMU displays 55
- EMU i ndicator di 56
- Audible alarm operations 57
- Enabling the audib le alarm 58
- Disabling the audible alarm 59
- Enclosure numb 60
- Error Condition Reporting 62
- Reporting group feature 65
- HSV cont 68
- High availability features 69
- Operator control panel 69
- Status indicators 70
- Navigation buttons 71
- Alphanumeric display 71
- Displaying the O CP menu tree 71
- Displayi 73
- Shutting down the system 74
- Shutting the controller down 74
- Restarting the system 75
- Uninitializing the system 75
- Password options 75
- Changing a pass 76
- Clearing a passwor d 76
- Cache battery 78
- HSV controller cabling 79
- Rack configurations 79
- Power distribut 80
- Rack AC power distribution 82
- Moving and stabilizing a rack 84
- 1. Hex nut 85
- 2. Leveler foot 85
- 5 Customer replaceabl e units 87
- Procuring the spare p art 88
- Replacing the cache battery 90
- Removing a battery 92
- Installing a bat tery 92
- Replacing a controller blower 93
- Removing 97
- Replacing a disk drive 98
- Removing a disk 99
- Installing a disk drive 100
- Adding a disk to the group 101
- Before you begin 101
- Verifying component failure 102
- Removing a blower 103
- Installing a blower 103
- Removing a power supply 104
- Installing a power supply 104
- V erifying proper operation 105
- Customer replaceable units 106
- A Regulatory n otices an d 107
- Laser device 108
- Laser safety warnings 109
- Class A equipment 109
- Class B equipment 109
- European union notice 110
- Notice for France 110
- WEEE Recycling Notices 110
- Greek notice 112
- Hungarian notice 112
- Latvian notice 113
- Lithuanian notice 113
- Polish not 113
- Portuguese notice 113
- Slovakian notice 114
- Slovenian notice 114
- Spanish not 114
- Swedish notice 114
- Harmonics conformance (Japan) 115
- Physical specifications 116
- Environmental s 117
- Power specifications 117
- Controller speci fications 119
- Power specificat 120
- Environmental specifications 120
- Rack specifications 121
- Condition report format 123
- Correcting errors 124
- Power supply conditions 126
- 0.2.en.02 127
- Blower conditions 128
- Temperature conditions 129
- 0.4.en.03 NON 131
- EMU conditions 132
- Transceiver conditions 136
- Backplane cond 139
- I/O M odule conditions 139
- CXO7951A 140
- Host conditio 141
- C Controller fault management 143
- Fault management displays 144
- Controller fault management 146
- Glossary 147
- XCS version,73 169
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